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17.175  Articles
1 of 1.719 pages  |  10  records  |  more records»
The problems of data transmission in metal directing mediums for the systems of data processing and objects control in digital integrated circuits are considered. Comparative analysis of the types of electronic logic circuits and directing mediums has bee... see more

Advances in manufacturing process technology are key ensembles for the production of integrated circuits in the sub-micrometer region. It is of paramount importance to assess the effects of tolerances in the manufacturing process on the performance of mod... see more

This paper concerns the local and remote use of an Integrated Circuits (IC) Automated Test Equipment (ATE) for both educational and engineering purposes. This experience was initiated in 1998 in the context of a French network (CNFM) in order to provide a... see more

In this paper, an online education tool for assisting the teaching and learning of the IEEE 1500 standard testability method, used to support the testing of complex system-on-a-chip (SoC) integrated circuits (ICs), is developed and presented. The tool is ... see more

A solution to implement a remote laboratory for testing and designing analog Application-Specific Integrated Circuits of the type (ispPAC10) is presented. The application allows electrical engineering students to access and perform measurements and conduc... see more

In the recent years the advancement in the field of microelectronics integrated circuit (IC) design technologies proved to be a boon for design and development of various advanced systems in-terms of its reduction in form factor, low power, high speed and... see more

Avionics subsystems continue to get smaller and more functional, driving the total circuit package itself to become denser, causing the printed wiring board (PWB) to evolve new laminates to meet these needs. There is a continuous scope for improvement to ... see more

This study investigates the dry etching of 60 mm dia, 200 mm deep holes for fabrication of through substrate via holes for grounding monolithic microwave integrated circuits (MMICs), on 3-inch dia semiinsulating GaAs wafer using RIE and ICP processes with... see more
GaAs |  MMIC |  Via-hole |  ICP |  RIE |  etching
Context. Transition of modern electronics to higher frequencies is directly related with an extremely important problem ofminiaturization of microwave integrated circuits. Conventional planar structures such as microstrip directional couplers have thefeat... see more

1 of 1.719 pages  |  10  records  |  more records»