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2.951  Articles
1 of 296 pages  |  10  records  |  more records»
In the printing section of a roll-to-roll gravure printed electronics machine, the plastic film tension is directly associated with the product quality. The temperature distribution of the plastic film in the printing section is non-uniform, because of th... see more

Additive manufacturing significantly reduces the lead time of the product development cycle in the way of design trials and thus reduces delivery time to the market. The essence has been understood by many sectors including, education, manufacturing indus... see more

This paper deals with mechanical design and development of high speed digital board (HSDB) system which consists of printed circuit board (PCB) with all electronic components packaged inside the cavity for military application. The military environment po... see more

The changes happened in recent decades have allowed technological advances invade our daily lives and significantly increase the consumption of Electrical and Electronic Equipment (EEE). With the life cycle reduced increasingly the related products have b... see more

In the packages and printed circuit boards (PCBs) of high-speed and mixed-signal electronics, parallel plate waveguides (PPWs) are frequently used as the power/ground plane pair, resulting in a significant problem of electrical switching noise such as sim... see more

It is becoming increasingly more important to provide a low-cost point-of-care diagnostic device with the ability to detect and monitor various biological and chemical compounds. Traditional laboratories can be time-consuming and very costly. Through the ... see more

Recently, amorphous indium-gallium-zinc-oxide thin film transistors (a-IGZO TFTs) with inkjet printing silver source/drain electrodes have attracted great attention, especially for large area and flexible electronics applications. The silver ink could be ... see more

This study aims to evaluate: 1) the amount and kinds of publications in Bogor Botanical Garden Publication from1994 to 2012; 2) the subjects of the publication; 3) the publishers’ name; 4) the language used in the publication; 5)the author’s sex; 6) autho... see more

This paper presents the methodology adopted for implementation of Peltier cooling in hermetically sealed electronic packaging units used in sub-sea vessels. In sub-sea vessels, sonar front-end electronics is packaged in hermetically sealed electronic pack... see more

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